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Yaode Technology (Shenzhen) Co.,Ltd

Address: 6D1-17, The sixth Floor, The building 203, Tairan Technopark, Tairan Four Street, Tian'an Community, Shatou Street, Futian Zone, Shenzhen City, Guangdong, China

Tel: +86-769-85378226

M/P: +8613825767293

E-mail: yaodepcb@163.com

PCB Development

- Sep 11, 2018 -

Printed boards from single-layer to double-sided, multilayer and flexible, and still maintain their respective development trend.

Due to continuous development to high-precision, high-density and high-reliability direction, continuously reduce the volume, reduce costs, improve performance, so that the printed circuit board in the future development of electronic equipment engineering, still maintain a strong vitality. The summary of the future development trend of PCB manufacturing technology is basically consistent, namely to high density, high precision, fine aperture, fine wire, fine spacing, high reliability, multilayer, high-speed transmission, light weight, thin type direction development, in the production at the same time to improve productivity, reduce costs, reduce pollution, adapt to many varieties, Small-volume production direction development.

The technical development level of the printed circuit is generally represented by the line width, aperture, thickness/aperture ratio of the printed board.


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